Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching

Author: Filippi R.G.   Gribelyuk M.A.   Joseph T.   Kane T.   Sullivan T.D.   Clevenger L.A.   Costrini G.   Gambino J.   Iggulden R.C.   Kiewra E.W.   Ning X.J.   Ravikumar R.   Schnabel R.F.   Stojakovic G.   Weber S.J.   Gignac L.M.   Hu C.-K.   Rath D.L.   Rodbell K.P.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.388, Iss.1, 2001-06, pp. : 303-314

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Abstract