Electrodeposition of Cu/Ni-P multilayers by a single bath technique

Author： Miyake T. Kume M. Yamaguchi K. Amalnerkar D.P. Minoura H.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.397, Iss.1, 2001-10, pp. : 83-89

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