Surface condition effects of the inter-metal dielectrics on interconnect aluminum film properties

Author： Kim S.-D.   Rhee J.-K.   Hwang I.-S.   Park H.-M.   Park H.-C.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.401, Iss.1, 2001-12, pp. : 273-278

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