Zincating morphology of aluminum bond pad: its influence on quality of electroless nickel bumping

Author: Qi G.   Fokkink L.G.J.   Chew K.H.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.406, Iss.1, 2002-03, pp. : 219-223

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Abstract