A new method for deposition of cubic Ta diffusion barrier for Cu metallization

Author: Yuan Z.L.   Zhang D.H.   Li C.Y.   Prasad K.   Tan C.M.   Tang L.J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.434, Iss.1, 2003-06, pp. : 126-129

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Abstract