Electrodeposition of adherent copper film on unmodified tungsten

Author： Wang C.   Lei J.   Bjelkevig C.   Rudenja S.   Magtoto N.   Kelber J.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.445, Iss.1, 2003-11, pp. : 72-79

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