Assessment of the adhesion quality of fusion-welded silicon wafers with nonlinear ultrasound

Author： Wegner A.   Koka A.   Janser K.   Netzelmann U.   Hirsekorn S.   Arnold W.  

Publisher： Elsevier

ISSN： 0041-624X

Source： Ultrasonics, Vol.38, Iss.1, 2000-03, pp. : 316-321

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