Author: Hwang T.W. Whitenton E.P. Hsu N.N. Blessing G.V. Evans C.J.
Publisher: Elsevier
ISSN: 0041-624X
Source: Ultrasonics, Vol.38, Iss.1, 2000-03, pp. : 614-619
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
PLASTICITY AND FRACTURE OF INORGANIC GLASSES AT HIGH SPEED GRINDING
Le Journal de Physique Colloques, Vol. 43, Iss. C9, 1982-12 ,pp. :
Acoustic-emission probing of line defects in silicon
By Skvortsov A. Orlov A. Solov’ev A.
Physics of the Solid State, Vol. 43, Iss. 4, 2001-04 ,pp. :
Using acoustic emission signals for monitoring of production processes
By Tonshoff H.K. Jung M. Mannel S. Rietz W.
Ultrasonics, Vol. 37, Iss. 10, 2000-07 ,pp. :
Application of acoustic emission sensor for monitoring machining processes
By Inasaki I.
Ultrasonics, Vol. 36, Iss. 1, 1998-02 ,pp. :
Analysis of acoustic emission signals and monitoring of machining processes
By Govekar E. Gradisek J. Grabec I.
Ultrasonics, Vol. 38, Iss. 1, 2000-03 ,pp. :