Author: Gericke K.-H. Geszner C. Scheffler P.
Publisher: Elsevier
ISSN: 0042-207X
Source: Vacuum, Vol.65, Iss.3, 2002-05, pp. : 291-297
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Pressure-dependence of etch rate in O 2 discharges
By Tae Kim M.
Thin Solid Films, Vol. 401, Iss. 1, 2001-12 ,pp. :
Law pressure magnetron sputtering and selfsputtering discharges
Vacuum, Vol. 47, Iss. 3, 1996-03 ,pp. :