Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Author： Kar Yap Boon Talik Noor Azrina Sauli Zaliman Fei Jean Siow Retnasamy Vithyacharan

ISSN： 1356-5362

Source： Microelectronics International, Vol.30, Iss.1, 2013-01, pp. : 14-18

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