Author: Jung Sang-Bae
Publisher: Springer Publishing Company
ISSN: 1385-3449
Source: Journal of Electroceramics, Vol.25, Iss.2-4, 2010-10, pp. : 140-144
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Oh Seogil Moon Jungwoo Kang Taewook Hong Surin Yi Jongheop
Journal of Electroceramics, Vol. 17, Iss. 2-4, 2006-12 ,pp. :
Interconnection Techniques for GaAs Packaging
By Buck T.J.
Circuit World, Vol. 18, Iss. 1, 1993-12 ,pp. :