Author: Trimm Marvin
Publisher: Springer Publishing Company
ISSN: 1529-8159
Source: Practical Failure Analysis, Vol.3, Iss.3, 2003-06, pp. : 17-31
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Non-Destructive Evaluation Methods of Materials and Structures
Defect and Diffusion Forum, Vol. 2015, Iss. 364, 2015-07 ,pp. :
JOM-e: The application of nondestructive evaluation technologies
By Liaw Peter
JOM, Vol. 55, Iss. 1, 2003-01 ,pp. :
Nondestructive evaluation techniques in semiconductor wafer fabrication
JOM, Vol. 51, Iss. 3, 1999-03 ,pp. :