Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1967-1976

Springer Publishing Company

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2564-2573

Springer Publishing Company

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Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

By Maleki Milad   Cugnoni Joë   Botsis John  

Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. : 1026-1042

Springer Publishing Company

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2588-2597

Springer Publishing Company

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Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

By Anderson Iver  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 390-397

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