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Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 105-108

Springer Publishing Company

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The bulk alloy microstructure and tensile properties of Sn-1Ag-0.5Cu- x Al lead-free solder alloys ( x =0, 1, 1.5 and 2 wt.%)

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

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Formation and Growth of Intermetallic Compound Cu 6 Sn 5 at Early Stages in Lead-Free Soldering

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