A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

By Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Microelectronics International, Vol. 29, Iss. 1, 2012-01 ,pp. : 47-57

Emerald Group Publishing Ltd

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Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

By Huang Z.  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 375-389

Springer Publishing Company

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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

By Li G.  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 165-175

Springer Publishing Company

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2588-2597

Springer Publishing Company

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Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

By Kumar P.  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 412-424

Springer Publishing Company

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