Reducing electronic component losses in lean electronics assembly with Six Sigma approach

Author： Yi Tan Ping   Feng Chin Jeng   Prakash Joshua   Ping Loh Wei  

Publisher： Emerald Group Publishing Ltd

ISSN： 2040-4166

Source： International Journal of Lean Six Sigma, Vol.3, Iss.3, 2012-08, pp. : 206-230

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