Localized electrochemical deposition and dissolution of Cu on microstructured Ti surfaces

Author： Voigt O. Davepon B. Staikov G. Schultze J.W.

Publisher： Elsevier

ISSN： 0013-4686

Source： Electrochimica Acta, Vol.44, Iss.21, 1999-06, pp. : 3731-3741

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