Electrodeposition of copper-tin alloy thin films for microelectronic applications

Author: Padhi D.   Gandikota S.   Nguyen H.B.   McGuirk C.   Ramanathan S.   Yahalom J.   Dixit G.  

Publisher: Elsevier

ISSN: 0013-4686

Source: Electrochimica Acta, Vol.48, Iss.8, 2003-04, pp. : 935-943

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Abstract