Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

Author: Pollock E.L.   Glosli J.   Shirron P.J.   DiPirro M.J.   Castles S.H.   Bills B.   Ho J.P.   Canavan E.R.   Moody M.V.   Singh R.   Fulin S.   Zikun W.   Zhonghua L.  

Publisher: Elsevier

ISSN: 0013-7944

Source: Engineering Fracture Mechanics, Vol.55, Iss.5, 1996-11, pp. : 737-750

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Abstract