Glass-modified stress waves for adhesion measurement of ultra thin films for device applications

Author： Gupta V. Kireev V. Tian J. Yoshida H. Akahoshi H.

Publisher： Elsevier

ISSN： 0022-5096

Source： Journal of the Mechanics and Physics of Solids, Vol.51, Iss.8, 2003-08, pp. : 1395-1412

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