Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

By Mahmudi R.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2495-2502

Springer Publishing Company

Access to resources Recommend Favorite

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

By Zhou Bite  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 262-272

Springer Publishing Company

Access to resources Recommend Favorite

Creep Behavior of Bi-Containing Lead-Free Solder Alloys

By Witkin David  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 190-203

Springer Publishing Company

Access to resources Recommend Favorite

Development of extremely ductile lead-free Sn-Al solders for futuristic electronic packaging applications

By Alam Md   Gupta Manoj  

Electronic Materials Letters, Vol. 10, Iss. 2, 2014-03 ,pp. : 515-524

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

By Yen Yee-Wen  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2412-2417

Springer Publishing Company

Access to resources Recommend Favorite