Die bonding with Au/In isothermal solidification technique

Author: Wang T.   Shen Z.   Ye R.   Xie X.   Stubhan F.   Freytag J.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.29, Iss.4, 2000-04, pp. : 443-447

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Abstract