The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

By Bieler Thomas  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 283-301

Springer Publishing Company

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Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling

By Li J.  

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 77-84

Springer Publishing Company

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Fatigue-creep crack propagation path in solder joints under thermal cycling

By Liu D.   Pao Yi-Hsin  

Journal of Electronic Materials, Vol. 26, Iss. 9, 1997-09 ,pp. : 1058-1064

Springer Publishing Company

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Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

By Anderson Iver  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 390-397

Springer Publishing Company

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A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

By Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Microelectronics International, Vol. 29, Iss. 1, 2012-01 ,pp. : 47-57

Emerald Group Publishing Ltd

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