Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests

Author： Xia Yanghua   Lu Chuanyan   Xie Xiaoming  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.36, Iss.9, 2007-09, pp. : 1129-1136

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

By Yen Yee-Wen  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2412-2417

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

By Noh Bo-In  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 224-231

Springer Publishing Company

Access to resources Recommend Favorite

Creep phenomena in lead-free solders

By Igoshev V.   Kleiman J.  

Journal of Electronic Materials, Vol. 29, Iss. 2, 2000-02 ,pp. : 244-250

Springer Publishing Company

Access to resources Recommend Favorite

The impact of lead-free soldering on electronics packages

By Yang L.   Bernstein J.B.   Chung K.  

Microelectronics International, Vol. 18, Iss. 3, 2001-12 ,pp. : 20-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

By Jeong Myeong-Hyeok  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2368-2374

Springer Publishing Company

Access to resources Recommend Favorite