Damage Produced in Solder Alloys during Thermal Cycling

By LIU X.W.   PLUMBRIDGE W.J.  

Journal of Electronic Materials, Vol. 36, Iss. 9, 2007-09 ,pp. : 1111-1120

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

By Laurila T.  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3179-3195

Springer Publishing Company

Access to resources Recommend Favorite

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

By Bieler Thomas  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 283-301

Springer Publishing Company

Access to resources Recommend Favorite

Fatigue-creep crack propagation path in solder joints under thermal cycling

By Liu D.   Pao Yi-Hsin  

Journal of Electronic Materials, Vol. 26, Iss. 9, 1997-09 ,pp. : 1058-1064

Springer Publishing Company

Access to resources Recommend Favorite

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

By Anderson Iver  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 390-397

Springer Publishing Company

Access to resources Recommend Favorite