Critical Current Density for Inhibiting (Cu,Ni) 6 Sn 5 Formation on the Ni Side of Cu/Solder/Ni Joints

By Wu W.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2653-2661

Springer Publishing Company

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Formation and Growth of Intermetallic Compound Cu 6 Sn 5 at Early Stages in Lead-Free Soldering

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Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2574-2582

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Effects of Ni Additions on the Growth of Cu 3 Sn in High-Lead Solders

By Wang Y.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2636-2642

Springer Publishing Company

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Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

By Gourlay C.  

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 56-69

Springer Publishing Company

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Elastic Moduli of (Ni,Cu) 3 Sn 4 Ternary Alloys from First-Principles Calculations

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Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2429-2434

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