Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder
Author： Chiang Yu-Yan
Publisher： Springer Publishing Company
ISSN： 1543-186X
Source： Journal of Electronic Materials, Vol.39, Iss.11, 2010-11, pp. : 2397-2402
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