Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

By He Xiaofei  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1921-1936

Springer Publishing Company

Access to resources Recommend Favorite

Material and electrical properties of electroless Ag-W thin film

By Inberg A.   Shacham-Diamand Y.   Rabinovich E.   Golan G.   Croitoru N.  

Journal of Electronic Materials, Vol. 30, Iss. 4, 2001-04 ,pp. : 355-359

Springer Publishing Company

Access to resources Recommend Favorite

Impact of In Situ Generated Ag 2 Te Nanoparticles on the Microstructure and Thermoelectric Properties of AgSbTe 2 Compounds

By Du B.  

Journal of Electronic Materials, Vol. 40, Iss. 5, 2011-05 ,pp. : 1249-1253

Springer Publishing Company

Access to resources Recommend Favorite

Effect of composition on the electrical properties of electroformed screen-printed thick film sandwich devices

By Arshak K. I.   Collins D. G.   Mcdonagh D.   Ansari F.  

International Journal of Electronics, Vol. 81, Iss. 4, 1996-10 ,pp. : 419-434

Taylor & Francis Ltd

Access to resources Recommend Favorite

Microstructure and Thermoelectric Properties of AgSbO 3 Ceramics Prepared by Ion-Exchange Powder Synthesis and Normal Sintering

By Li Fu  

Journal of Electronic Materials, Vol. 40, Iss. 5, 2011-05 ,pp. : 1035-1041

Springer Publishing Company

Access to resources Recommend Favorite