Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Author： ÇadIrlI E.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.40, Iss.2, 2011-02, pp. : 195-200

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The effect of Pb contamination on the solidification behavior of Sn-Bi solders

By Moon Kil-Won   Boettinger William   Kattner Ursula   Handwerker Carol   Lee Doh-Jae  

Journal of Electronic Materials, Vol. 30, Iss. 1, 2001-01 ,pp. : 45-52

Springer Publishing Company

Access to resources Recommend Favorite

Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

By Mahmudi R.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2495-2502

Springer Publishing Company

Access to resources Recommend Favorite

Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

By Arfaei B.  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 362-374

Springer Publishing Company

Access to resources Recommend Favorite

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

By Hacke P.   Sprecher A.   Conrad H.  

Journal of Electronic Materials, Vol. 26, Iss. 7, 1997-07 ,pp. : 774-782

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb 100−x -Sn x Solders

By Çadirli E.  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1903-1911

Springer Publishing Company

Access to resources Recommend Favorite