Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

By Kim Jae-Myeong  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 791-799

Springer Publishing Company

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Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

By Kim Young  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 763-773

Springer Publishing Company

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

By Arfaei B.  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 362-374

Springer Publishing Company

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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

By Li G.  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 165-175

Springer Publishing Company

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2588-2597

Springer Publishing Company

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