Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2564-2573

Springer Publishing Company

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Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 273-282

Springer Publishing Company

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2588-2597

Springer Publishing Company

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A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

By Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Microelectronics International, Vol. 29, Iss. 1, 2012-01 ,pp. : 47-57

Emerald Group Publishing Ltd

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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1895-1902

Springer Publishing Company

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