Kinetic and topographic investigation of copper deposition/stripping in an acid copper environment

Author: Hartig P.   Wunsche M.   Kussner T.   Schumacher R.  

Publisher: Elsevier

ISSN: 1388-2481

Source: Electrochemistry Communications, Vol.1, Iss.9, 1999-09, pp. : 398-401

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