Period of time： 2004年5期
Publisher： Elsevier
Founded in： 1982
Total resources： 4
ISSN： 0167-577X
Subject： TB General Industrial Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Materials Letters,volume 58,issue 5
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Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress
By Li M., Chu W.Y., Gao K.W., Qiao L.J. in (2004)
Materials Letters,volume 58,issue 5 , Vol. 58, Iss. 5, 2004-02 , pp.
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