Circuit World,volume 27,issue 1  (01-2014)

Period of time： 2014年1期

Publisher： Emerald Group Publishing Ltd

Founded in： 1974

Total resources： 123

ISSN： 0305-6120

Subject： TM Electrotechnical

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Circuit World,volume 27,issue 1

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Allowable copper thickness for fine pitch patterns formed by a subtractive method

By Yamamoto Takuya,Kataoka Takashi,Andresakis John in (2001)

Circuit World,volume 27,issue 1 , Vol. 27, Iss. 1, 2001-01 , pp. 6-12

Emerald Group Publishing Ltd

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Specially developed glass fabrics for ultimate small diameter holes of high density board by build-up method

By Kimura Yasuyuki in (2001)

Circuit World,volume 27,issue 1 , Vol. 27, Iss. 1, 2001-01 , pp. 13-19

Emerald Group Publishing Ltd

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Elastic, elastic-plastic and creep analyses of wafer level chip scale package solder joints on microvia build-up printed circuit boards

By Lau John H in (2001)

Circuit World,volume 27,issue 1 , Vol. 27, Iss. 1, 2001-01 , pp. 20-31

Emerald Group Publishing Ltd

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Residues in printed wiring boards and assemblies

By Pauls Douglas in (2001)

Circuit World,volume 27,issue 1 , Vol. 27, Iss. 1, 2001-01 , pp. 32-41

Emerald Group Publishing Ltd

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Total 4 item(s)