Circuit World,volume 29,issue 1  (01-2014)

Period of time： 2014年1期

Publisher： Emerald Group Publishing Ltd

Founded in： 1974

Total resources： 123

ISSN： 0305-6120

Subject： TM Electrotechnical

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Circuit World,volume 29,issue 1

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The new immersion tin generation in practical operation - a surface finish process including the world's first organic metal

By Schröder Sabine in (2003)

Circuit World,volume 29,issue 1 , Vol. 29, Iss. 1, 2003-01 , pp. 10-13

Emerald Group Publishing Ltd

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Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs)

By Rapala-Virtanen Tarja in (2003)

Circuit World,volume 29,issue 1 , Vol. 29, Iss. 1, 2003-01 , pp. 14-18

Emerald Group Publishing Ltd

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Surface coatings for fluxless soldering of copper

By Liu Changqing,Hutt David A in (2003)

Circuit World,volume 29,issue 1 , Vol. 29, Iss. 1, 2003-01 , pp. 19-23

Emerald Group Publishing Ltd

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How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs)

By Weinhold Michael,Yen George in (2003)

Circuit World,volume 29,issue 1 , Vol. 29, Iss. 1, 2003-01 , pp. 24-31

Emerald Group Publishing Ltd

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An introduction to laser direct imaging for high density interconnects

By Omer Udi in (2003)

Circuit World,volume 29,issue 1 , Vol. 29, Iss. 1, 2003-01 , pp. 32-35

Emerald Group Publishing Ltd

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Total 5 item(s)