Effect of sulphur content and pre-annealing treatments on nickel grain-boundary diffusion in high-purity copper

Author： Tokei Zs. Erdelyi Z. Girardeaux Ch. Rolland A.

ISSN： 0141-8610

Source： Philosophical Magazine. A. Physics of Condensed Matter. Defects and Mechanical Properties, Vol.80, Iss.5, 2000-05, pp. : 1075-1083

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