ADVANCED ENGINEERING MATERIALS (ELECTRONIC)

Publisher： John Wiley & Sons Inc

Founded in： 1999

Total resources： 40

E-ISSN： 1527-2648

ISSN： 1438-1656

Subject： TB3 Engineering Materials

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ADVANCED ENGINEERING MATERIALS (ELECTRONIC)

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Fused Deposition Modeling for Unmanned Aerial Vehicles (UAVs): A Review

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Novel 3D‐Printed Hybrid Auxetic Mechanical Metamaterial with Chirality‐Induced Sequential Cell Opening Mechanisms

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Using Post‐Deformation Annealing to Optimize the Properties of a ZK60 Magnesium Alloy Processed by High‐Pressure Torsion

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Understanding Wear Interface Evolution to Overcome Friction and Restrain Wear of TiAl–10 wt%Ag Composite

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Challenges of Diffusion Bonding of Different Classes of Stainless Steels

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Effect of Thermal Oxidation on Microstructure and Corrosion Behavior of the PVD Hf‐Coated Mg Alloy

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Front Cover: Advanced Engineering Materials 2∕2018

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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The Fabrication and Characterization of Bimodal Nanoporous Si with Retained Mg through Dealloying

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Synthesis of Composite Nanosheets of Graphene and Boron Nitride and Their Lubrication Application in Oil

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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Enhanced Thermal Conductivity of 5A Molecular Sieve with BNs Segregated Structures

ADVANCED ENGINEERING MATERIALS (ELECTRONIC) , Vol. 20, Iss. 2, 2018-02 , pp. n/a-n/a

John Wiley & Sons Inc

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