THERMAL STRESS ANALYSIS AND DESIGN OPTIMIZATION OF DIRECT CHIP ATTACH (DCA) AND CHIP SCALE PACKAGE (CSP) IN FLIP CHIP TECHNOLOGY

Author： LIU D. S.   NI C. Y.   TSAY T. C.   KAO C. Y.  

Publisher： Taylor & Francis Ltd

ISSN： 0305-215X

Source： Engineering Optimization, Vol.34, Iss.6, 2002-01, pp. : 591-611

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

USING A NEW STRATEGY TO OPTIMIZE THE BUMP DESIGN PARAMETERS IN FLIP CHIP PACKAGES

By LIU D. S.   NI C. Y.   Kao C. Y.  

Engineering Optimization, Vol. 34, Iss. 4, 2002-01 ,pp. : 355-367

Taylor & Francis Ltd

Access to resources Recommend Favorite

Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

By Wang J.   Zou D.   Lu M.   Ren W.   Liu S.  

Engineering Fracture Mechanics, Vol. 64, Iss. 6, 1999-12 ,pp. : 781-797

Elsevier

Access to resources Recommend Favorite

Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices

By Liu Tao-Chi   Chen Chih   Liu Shih-Ting   Chang Ming-Lun   Lin Jandel  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 10, 2011-10 ,pp. : 1536-1541

Springer Publishing Company

Access to resources Recommend Favorite

Weighing System Design Based on Single Chip Microcomputer

By  

Advanced Materials Research, Vol. 2014, Iss. 1070, 2015-01 ,pp. : 1572-1575

Trans Tech Publications

Access to resources Recommend Favorite

Guard against Theft Detector Design Based on Single Chip Microcomputer Signal Processing Technology

By  

Advanced Materials Research, Vol. 2014, Iss. 1079, 2015-02 ,pp. : 1064-1067

Trans Tech Publications

Access to resources Recommend Favorite