![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Marczewska-Boczkowska Krystyna Kosmulski Marek
Publisher: Taylor & Francis Ltd
ISSN: 1042-6914
Source: Materials and Manufacturing Processes, Vol.24, Iss.10-11, 2009-10, pp. : 1173-1179
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Ou Rongxian Xie Yanjun Shen Xiaoping Yuan Feipin Wang Haigang Wang Qingwen
Journal of Materials Science, Vol. 47, Iss. 16, 2012-08 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Vidhya V. Vatsala Rani J. Ratheesh Kumar A. Thangamuthu R. Murali K. Jayachandran M.
Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. :