A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: DECOMPOSITION ANALYSIS OF WAFER SURFACES
Author： Lu W. K.
Publisher： Taylor & Francis Ltd
ISSN： 1091-0344
Source： Machining Science and Technology, Vol.11, Iss.1, 2007-01, pp. : 81-97
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
