An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Author： Pei Z.J.   Kassir S.   Bhagavat M.   Fisher G.R.  

Publisher： Elsevier

ISSN： 0890-6955

Source： International Journal of Machine Tools and Manufacture, Vol.44, Iss.2, 2004-02, pp. : 299-306

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