SURFACE INTEGRITY AND REMOVAL RATE OF SILICON SPUTTERED WITH FOCUSED ION BEAM

Author: Hung N.   Ali M.   Fu Y.   Ong N.   Tay M.  

Publisher: Taylor & Francis Ltd

ISSN: 1091-0344

Source: Machining Science and Technology, Vol.5, Iss.2, 2001-01, pp. : 239-254

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Abstract