Sliding contacts on printed circuit boards and wear behavior

By Le Solleu J.-P.  

EPJ Applied Physics (The), Vol. 50, Iss. 1, 2010-04 ,pp. : 12902-12902

Edp Sciences

Access to resources Recommend Favorite

Dividing of metal and plastic components of printed circuit boards

By  

MATEC Web of conference, Vol. 125, Iss. issue, 2017-10 ,pp. : 02040-02040

Edp Sciences

Access to resources Recommend Favorite

Global Environment Facility investments in the phase-out of ozone-depleting substances

By Dixon Robert  

Mitigation and Adaptation Strategies for Global Change, Vol. 16, Iss. 5, 2011-06 ,pp. : 567-584

Springer Publishing Company

Access to resources Recommend Favorite

Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic

By      

Journal of the Air & Waste Management Association, Vol. 64, Iss. 9, 2014-09 ,pp. : 1085-1092

Taylor & Francis Ltd

Access to resources Recommend Favorite

Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

By Araújo Manuel  

MATEC Web of conference, Vol. 80, Iss. issue, 2016-10 ,pp. : 16009-16009

Edp Sciences

Access to resources Recommend Favorite