Homogenization on Multi-Materials’ Elements: Application to Printed Circuit Boards and Warpage Analysis

E-ISSN： 2261-236x|80|issue|16009-16009

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.80, Iss.issue, 2016-10, pp. : 16009-16009

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Sliding contacts on printed circuit boards and wear behavior

By Le Solleu J.-P.

EPJ Applied Physics (The), Vol. 50, Iss. 1, 2010-04 ,pp. : 12902-12902

Edp Sciences

Access to resources Recommend Favorite

Dividing of metal and plastic components of printed circuit boards

MATEC Web of conference, Vol. 125, Iss. issue, 2017-10 ,pp. : 02040-02040

Edp Sciences

Access to resources Recommend Favorite

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

By Lee Richard Wright Bob

Environmental Forensics, Vol. 9, Iss. 4, 2008-10 ,pp. : 320-339

Taylor & Francis Ltd

Access to resources Recommend Favorite

Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic

Journal of the Air & Waste Management Association, Vol. 64, Iss. 9, 2014-09 ,pp. : 1085-1092

Taylor & Francis Ltd

Access to resources Recommend Favorite

Improving sustainable recovery of metals from waste printed circuit boards by the primary copper smelter process

By Le Hoang-Long Yamasue Eiji Okumura Hideyuki Ishihara Keiichi

Journal of Material Cycles and Waste Management, Vol. 16, Iss. 2, 2014-04 ,pp. : 298-305

Springer Publishing Company

Access to resources Recommend Favorite