Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages

Author: Asai SHIN'ICHIRO   Ando Takayuki   Tobita Masayuki  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.10, Iss.1, 1996-01, pp. : 1-15

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Abstract