A failure criterion for debonding between encapsulants and leadframes in plastic IC packages

Author： Yi Sung   Shen Lianxi   Kim Jang Kyo   Yue Chee Yoon  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.14, Iss.1, 2000-01, pp. : 93-105

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages

By Asai SHIN'ICHIRO   Ando Takayuki   Tobita Masayuki  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 1, 1996-01 ,pp. : 1-15

Taylor & Francis Ltd

Access to resources Recommend Favorite

Peel testing of adhesively bonded thin metallic plates with control of substrate plastic straining and of debonding mode mixity

By Sener Jean-Yves  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 10, 2001-10 ,pp. : 1165-1188

Taylor & Francis Ltd

Access to resources Recommend Favorite

Theoretical and experimental studies for the failure criterion of adhesively bonded joints

By Lee Kang Yong   Kong Byung Seok  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 6, 2000-03 ,pp. : 817-832

Taylor & Francis Ltd

Access to resources Recommend Favorite

An energy-based failure criterion for delamination initiation in electronic packaging

By Fan Hai Bo   Chung Paular W. K.   Yuen Matthew M. F.   Chan Philip C. H.  

Journal of Adhesion Science and Technology, Vol. 19, Iss. 15, 2005-12 ,pp. : 1375-1386

Taylor & Francis Ltd

Access to resources Recommend Favorite

Pull-out behavior of oxidized copper leadframes from epoxy molding compounds

By Lee Ho-Young   Kim Sung-Ryong  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 6, 2002-05 ,pp. : 621-651

Taylor & Francis Ltd

Access to resources Recommend Favorite