Adhesion of electrolessly-deposited copper to photosensitive epoxy

By Ge J.   Tuominen R.   Kivilahti J. K.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 10, 2001-10 ,pp. : 1133-1143

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Improved adhesion between plasma-treated polyimide film and evaporated copper

By Inagaki N.   Tasaka S.   Hibi K.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 395-410

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Development and thermal durability of an interfacial bond between electrolessly deposited metals and a fluorinated polyimide

By Baumgartner Charles E.   Scott Lisa Renee  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 7, 1995-01 ,pp. : 789-799

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Adhesion and interface studies between copper and polyimide

By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

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Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

By Yang G. H.   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 6, 2001-06 ,pp. : 727-746

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