Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

By Yang G. H.   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 6, 2001-06 ,pp. : 727-746

Taylor & Francis Ltd

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Adhesion interaction between electrolessly deposited copper film and polyimide

By Vorobyova T.N.  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 167-182

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Effects of the alkaline permanganate etching of epoxy on the peel adhesion of electrolessly plated copper on a fibre-reinforced epoxy composite

By Kirmann J.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 4, 1998-01 ,pp. : 383-397

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Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper

By Wu Shaoyu   Kang E. T.   Neoh K. G.  

Journal of Adhesion Science and Technology, Vol. 14, Iss. 11, 2000-09 ,pp. : 1451-1468

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Adhesion of electrolessly deposited Ni(P) on alumina ceramic: An assessment of the current status

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Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 115-130

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