Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an AC nitrogen glow discharge

By Ma J.B.  

Journal of Adhesion Science and Technology, Vol. 9, Iss. 4, 1995-01 ,pp. : 487-499

Taylor & Francis Ltd

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Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

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Silane-modified kaolins as fillers in rubber compositions

By Domka Ludwik  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 1-6

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Adhesion and interface studies between copper and polyimide

By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

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Surface modification of polyimide film surface by silane coupling reactions for copper metallization

By Inagaki N.   Tasaka S.   Baba T.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 7, 2001-07 ,pp. : 749-762

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