Thickness-dependent conduction behavior of various particles for conductive adhesive applications

By Sancaktar Erol  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 7, 1999-01 ,pp. : 763-771

Taylor & Francis Ltd

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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

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Pressure-Dependent Plasticity for Structural Adhesive Constitutive Modeling

By Jousset P.  

Journal of Adhesion Science and Technology, Vol. 24, Iss. 11-12, 2010-08 ,pp. : 1995-2010

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Silver coating of spindle- and filament-type magnetic particles for conductive adhesive applications

By Dilsiz Nursel  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 8, 1997-01 ,pp. : 1105-1118

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Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive

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Journal of Adhesion Science and Technology, Vol. 19, Iss. 8, 2005-08 ,pp. : 659-678

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